High-Precision Progressive Stamping for Thin-Gauge (0.05-1.2mm)
Electronic Components & Shields Mass Production
1．Progressive Die Stamping Quick Detail
In the semiconductor and microelectronics packaging field,
progressive die stamping is a core technology for manufacturing
leadframes and precision connectors. We focus on this cutting-edge
field and have the capability to perform micron-level precision
machining on ultra-thin, highly conductive materials. We not only
pursue extreme dimensional accuracy but also emphasize the
integrity of the material's crystal structure, surface cleanliness,
and the uniformity of the electroplated layer to ensure the final
packaging yield and long-term reliability of the devices.
2. Progressive Die Stamping Product Description
We don't produce ordinary metal sheets, but rather the crucial
carriers that support integrated circuit chips and enable their
electrical connection to the outside world—lead frames. The width,
spacing, and coplanarity of each lead directly affect the bonding
quality and heat dissipation performance of the chip. We utilize
ultra-high precision continuous die technology, combined with
precise electroplating and etching post-processing, to produce
various lead frames that meet stringent standards such as JEDEC,
serving diverse needs from discrete devices to high-end QFN and DFN
packages.
3． Progressive Die Stamping Product Features & Advantage
Feature | Advantage to You |
Micron-Level Dimensional & Geometric Accuracy | Achieve lead width and pitch tolerances within ±0.01mm, overall
coplanarity ≤0.02mm, providing a perfect foundation for automated
chip wire bonding. |
Ultra-Clean Production & Contamination Control | Key production and cleaning processes are carried out in a
controlled environment, with strict control over particulate
matter, oil, and ion contamination to meet the stringent
cleanliness requirements of the semiconductor industry. |
High-Density Multi-Lead Array Forming | Capable of stably producing high-density lead frames with over 100
leads and lead pitches less than 0.4mm, supporting the development
of advanced packaging technologies. |
Precision Selective Plating Technology | Precisely plate precious metals like silver, palladium, or gold on
designated areas of the frame (e.g., inner leads, outer leads),
ensuring excellent solderability and bondability while controlling
costs. |
Complete Material & Process Traceability | Establish a full-process traceability system from the copper strip
raw material batch to the final plating batch, and provide CPK data
reports for critical dimensions, supporting your quality system. |
4．Progressive Die Stamping Product Specification
Specification Item | Detail / Range | Note |
Material Thickness (Lead Frame) | 0.10, 0.127, 0.15, 0.20, 0.25 mm | Standard thicknesses available |
Minimum Lead Width/Pitch | 0.08 mm / 0.15 mm | Design and material dependent |
Lead Coplanarity | ≤ 0.025 mm (Typical) | 4σ standard |
Blanking Burr Height | ≤ 0.010 mm | Key indicator, preventing short circuits |
Plating Layer Thickness Uniformity | Within ±10% | Localized plating control |
Surface Cleanliness (Particles) | Complies with customer-specified standards | e.g., number of particles ≥0.3μm |
Packaging Form | Reel or Waffle Pack | Anti-static, anti-oxidation |
5. Progressive Die Stamping Product Application
Our products form the "skeleton" and "blood vessels" of integrated
circuits:
Discrete device packaging: Lead frames for diodes, transistors, and
power MOSFETs, requiring high current carrying capacity and
excellent heat dissipation design.
Integrated circuit packaging | QFN (Quad Flat No-Lead), DFN, SOP,
SOT series lead frames, etc., are the basic materials for
mainstream chip packaging.
Power module packaging: Terminals and substrates for IGBT and SiC
modules, requiring thick copper stamping and high current carrying
capacity.
Optoelectronic device packaging | LED brackets, requiring high
reflectivity surfaces and precise cup molding.
6. Frequently Asked Questions (FAQ)
Q: Can you handle complex custom designs and provide design
optimization suggestions
A: Absolutely. This is our core expertise. We provide free DFM
analysis within 3-5 days, often helping clients achieve 15-30% cost
reduction through design for manufacturability.
Q: How do you ensure quality consistency and handle defect issues?
A: We implement a rigorous 4-stage QC system with 100% full
inspection. Our track record shows 99.99% qualification rate.
Q: What are your lead times and how do you handle urgent orders?
A: Standard lead times: 3-7 days for prototypes, 7-15 days for mass
production. We offer VIP prioritization cutting lead times by up to
30%.
Q: Will I get timely responses and professional support throughout
the project?
A: Yes. You get a 1v1 exclusive consultant with 1-hour initial
response commitment and 24-hour technical support.
Q: Can you provide material certifications and environmental
compliance reports?
A: Yes. We provide material certifications and environmental test
reports (RoHS, REACH compliant) upon request.
Q: How do you protect my designs and intellectual property?
A: We start with mutual NDA and implement strict mold ownership
protection and confidential data security measures.
Q: What are your payment terms and MOQ requirements?
A: We offer flexible payment terms (T/T, L/C at sight) and MOQ from
1 piece for prototyping.
